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QSFP56 200G(4x50G) CWDM4 10km LR4 LC DX光模块
QSFP56 200G光模块
型   号:JFTSM-QSFP56-200(4x50)-CW4-10(LR4)-LCD
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产品型号
JFTSM-QSFP56-200(4x50)-CW4-10(LR4)-LCD
工厂品牌
JFOPT嘉富
封装形式
QSFP56
光口类型
LC双联
最高总速率
200Gbps
每通道速率
26.5625Gbps
最大传输距离
10km
工作波长
1310nm
工作电压
3.3V
光纤型号
SMF
纤芯尺寸
9/125
发射器类型
DFB
接收器类型
PIN
发射功率
-3.4~5.3dBm
接收灵敏度
-7.7dBm
数字诊断(DDM)
YES
接收过载
5.3dBm
功耗
<8W
支持协议
5G backhaul
Switch&Router connections
Data centers 200GE 10km SMF links
工作温度(商业级)
0℃~+70℃
储存温度(商业级)
-40℃~+85℃


 

生产线介绍
PRODUCTION LINE INTRODUCTION
 

JFOPT嘉富持续投入光模块生产领域,产品覆盖1*9、SFP、10G、25G、100G、200G、400G、800G GPON/EPON/XG/XGSPON OLT等全系列光模块。同时为下游同行提供TOSA、ROSA、BOSA等光器件半成品解决方案。JFOPT嘉富生产线具备日产量一万只光模块、两万只光器件的能力。此外,JFOPT嘉富光模块拥有业界领先的耐高温、抗干扰特性,广泛应用于计算中心、运营商、交通安防、电力设施等行业领域。





产品介绍
PRODUCT PRESENTATION
 

JFOPT QSFP56 200G (4x50G) CWDM4 2km FR4 LC DX光模块是一款高性能热插拔模块,采用PAM4调制技术实现每通道50Gbps的光数据传输。该模块支持通过单模光纤进行最长2公里的数据传输,采用紧凑型QSFP56封装。其内部集成先进组件,包括高性能激光二极管(LD)、光电探测器(PIN)和数字信号处理器(DSP),可确保在严苛的数据通信应用场景中实现稳定高效的运行。





光模块系列产品
TRANSCEIVER SERIES PRODUCTS
 





生产及检测设备
PRODUCTION & TESTING EQUIPMENT
 





产品特点
FEATURES
 
Hot-pluggable QSFP56 form factor LC connector
200GBASE-LR4 compliant-4x26.5625 GBd PAM4 200GAUI-4  compliant-4x26.5625 GBd PAM4
Maximum link length of 10km via SMF fiber Digital diagnostics functions are available via the I2C interface
Single 3.3V power supply Power dissipation:<8W
CMIS 4.0 management  interface Operating case temperature:0℃~+70℃





应用范围
APPLICATION
 
5G backhaul Switch & Router connections
Data centers 200GE 10Km SMF links  




符合标准
STANDARD COMPLIANCE
 

 


绝对最大额定值
ABSOLUTE MAXIMUM RATINGS
 
Parameter Symbol Min. Max. Unit
Power supply voltage VCC -0.5  +3.6  V
Storage temperature TC -40  +85 
Relative humidity RH 85  %

These values represent the damage threshold of the module.Stress in excess of any of the individual absolute maximum ratingscan cause immediate catastrophic damage to the module even if all other parameters are within recommended operating conditions.






推荐的操作环境
RECOMMENDED OPERATING ENVIRONMENT
 
Parameter Symbol Min Typical Max Unit
Power supply voltage VCC 3.135 3.30 3.465 V
Operating case temperature Tca 0 - 70


Recommended operating environment specifies parameters for which the electrical and optical characteristics hold unless otherwise noted.

 




电气特性
ELECTRICAL CHARACTERISTICS
 
Parameter Symbol Min Typical Max Unit Notes
Signaling rate per lane - -100ppm 26.5625 +100ppm Gbd -

Transmitter
 
Differential input  impedance Zin 90 100 110 ohm -
Differential input voltage amplitude △Vin - - 900 mVp-p -

Receiver
 
Differential output impedance Zout 90 100 110 ohm -
Differential output voltage amplitude △Vout 900 - - mVp-p AtTPla

The following electrical characteristics are defined over the Recommended Operating Environment unless otherwise specified.






光学特性
OPTICAL CHARACTERISTICS
 
Parameter Symbol Min Typical Max Unit Notes

Transmitter
 
Center wavelength Ch0 λo 1294.53 - 1296.59 nm -
Ch1 λ1 1299.02 - 1301.09
Ch2 λ2 1303.54 - 1305.63
Ch3 λ3 1308.09 - 1310.19
Side-mode suppression ratio SMSR 30 - - dB -
Average optical power,each lane Po -3.4 - 5.3 dBm -
Outer optical modulation amplitude(each ane) OMAout -0.4 - 5.1 dBm -
Launch power in OMAouter minus TDECQ Ptdecq -1.8 - - dBm -
Extinction ratio ER 3.5 - - dBm -
Transmitter and dispersion eye closurefor PAM4 per lane TDECQ - - 3.4 dB -
Average launch power of off transmitter(each lane) Poff - - -30 dBm -
Optical return Loss tolerance ORL - - 15.1 dB -

Receiver
 
Center wavelength Ch0 λo 1294.53 - 1296.59 nm -
Ch1 λ1 1299.02 - 1301.09
Ch2 λ2 1303.54 - 1305.63
Ch3 λ3 1308.09 - 1310.19
Damage threshold DT 6.3 - - dBm -
Average receive power ,each lane - -9.7 - 5.3 dBm -
Receiver reflectance Rfl - - -26 dB -
Receiver power(OMAouter),each lane OMAout - - 5.1 dBm -
Stressed receiver sensitivity(OMAouter), each lane Sens - - -5.2 dBm -
Receiver sensitivity(OMAouter), each lane Sen - - -7.7 dBm 1

Note:
[1]Measured with conformancetest signal at TP3 for the BER specified in IEEE802.3bs
 

The following optical characteristics are defined over the recommended operating environment unless otherwise specified.






QSFP56 收发器电气焊盘布局
QSFP56 TRANSCEIVER ELECTRICAL PAD LAYOUT
 






引脚定义
PIN DEFINITIONS
 
Pin Symbol Name/Description
1 GND Ground
2 Tx2n Transmitter inverted data input
3 Tx2p Transmitter non-inverted data input
4 GND Ground
5 Tx4n Transmitter inverted data input
6 Tx4p Transmitter non-inverted data input
7 GND Ground
8 ModSelL Module select
9 ResetL Module reset
10 VCCRx +3.3V power supply receiver
11 SCL 2-wire serial interface clock
12 SDA 2-wire serial interface data
13 GND Ground
14 Rx3p Receiver non-inverted data output
15 Rx3n Receiver inverted data output
16 GND Ground
17 Rxlp Receiver non-inverted data output
18 Rx1n Receiver inverted data output
19 GND Ground
20 GND Ground
21 Rx2n Receiver inverted data output
22 Rx2p Receiver non-inverted data output
23 GND Ground
24 Rx4n Receiver inverted data output
25 Rx4p Receiver non-inverted data output
26 GND Ground
27 ModPrsL Module present
28 IntL Interrupt
29 VCC Tx +3.3V power supply transmitter
30 VCC1 +3.3V power Supply
31 LPMode Low power mode
32 GND Ground
33 Tx3p Transmitter non-inverted data input
34 Tx3n Transmitter inverted data input
35 GND Ground
36 Txlp Transmitter non-inverted dataInput
37 Tx1n Transmitter inverted data input
38 GND Ground




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PRODUCT PACKAGING
 



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PRODUCT CERTIFICATION
 





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